Shanghai Industrial μTechnology Research Institute organize “Innovative Assembling and Testing Technology Seminar”. The user-oriented seminar during the Sensor China 2015 exhibition has gained praise from users and exhibitors. It is a high-class, forward-looking conference and focusing on intelligent manufacturing, assembling and testing.
The seminar was the concurrent event aiming at the fields of aerospace, automotive, defense electronics, petrochemical, pharmaceutical, transportation, power electronics. It will put stress on sensors, test and measurement products and technology.
Agenda:
| Innovative Assembling and Testing Technology Seminar | ||
| Time | Topic | Speaker |
| 9:30-10:15 | Keynote Speech: One-stop Packaging and Testing Program | Choon Heung Lee, CTO
Amkor |
| 10:15-10:45 | Silicon Packaging Technology | Zhi Wang
Director of Product Management Goertek |
| 10:45-11:15 | IoT Device Testing and its Challenges | Dejia Kong,
Business Development Manager Advantest |
| 11:15-11:45 | Assembly Technology Evolvement in IoT era | Edward Yang Ph.D.
Process Engineering Director ASE Group |
| 11:45-13:00 Lunch | ||
| 13:00-13:30 | IoT Drives Demand for 3DIC | Russell Liu, VP
WLCSP |
| 13:30-14:00 | The New Package Application for IoT | Jack Tu, R&D VP
Lingsen |
| 14:00-14:15 Tea Break | ||
| 14:15-14:45 | Wafer Level Integration towards 3DIC: Status and Prospectus | Herb Huang, Senior Director
SMIC |
| 14:45-15:15 | Advanced Fingerprint Assembling | Jianyou Xie, President
Hua Tian Xi’an |
| 15:15-15:45 | MEMS Analysis and Testing Platform | Joy Zhang, Director
SITRI |
| 15:45-16:30 | Panel Discussion | Speakers |
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